Title:
THERMOSETTING RESIN COMPOSITIONS
Document Type and Number:
Japanese Patent JPS5254798
Kind Code:
A
Abstract:
PURPOSE: A thermosetting resin composition of maleimide-epoxy series with both improved thermal resistance and performance, prepared by incorporating an addition product of a polymaleimide and an aminophenol with an epoxy resin.
Inventors:
TANAKA GOROU
SUZUKI HIROSHI
SUZUKI HIROSHI
Application Number:
JP13042075A
Publication Date:
May 04, 1977
Filing Date:
October 31, 1975
Export Citation:
Assignee:
HITACHI LTD
International Classes:
C09D5/03; C08G59/00; C08G59/40; C08G59/60; C09D163/00; (IPC1-7): C08G59/60