Title:
THERMOSETTING RESIN AND CURING OF THE SAME
Document Type and Number:
Japanese Patent JP3519144
Kind Code:
B2
Abstract:
PURPOSE: To provide a thermosetting resin having excellent low-temperature curability and good weather resistance and can give useful products such as coating materials, adhesives and sealing agents and to provide a method for curing the same.
CONSTITUTION: This resin is prepared by copolymerizing a monomer having a polymerizable double bond and an acetoacetyl group in the molecule with a monomer having a polymerizable double bond and a hydrolyzable alkoxysilane group in the molecule and other monomers. This resin can be cured at low temperatures by reacting it with a compound having a prim. amino group.
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Inventors:
Ishihara, Takamasa
Kondo, Osamu
Tsuka, Hirobumi
Kondo, Osamu
Tsuka, Hirobumi
Application Number:
JP28755794A
Publication Date:
April 12, 2004
Filing Date:
October 26, 1994
Export Citation:
Assignee:
SHINTO PAINT CO LTD
International Classes:
C08F8/00; C08F8/32; C08F18/02; C08F20/10; C08F30/08; C08F218/02; C08F218/12; C08F220/10; C08F220/18; C08F230/08; C09D157/10; C09J157/10; C09K3/10; (IPC1-7): C08F220/10; C08F8/00; C08F8/32; C09D157/10; C09K3/10