Title:
熱硬化性樹脂充填材、その硬化物および多層プリント配線板
Document Type and Number:
Japanese Patent JP7441928
Kind Code:
B2
Abstract:
To provide a thermosetting resin filler which has high adhesion to both a conductive part and an insulating part, and is excellent in electric insulation property.SOLUTION: A thermosetting resin filler contains an epoxy resin, an epoxy resin curing agent and an inorganic filler, in which the epoxy resin contains an epoxy resin having tertiary amine and an epoxy resin having a bisphenol type skeleton, and the epoxy resin curing agent contains at least two curing agents of a curing agent having an activation temperature of 60°C or higher and 130°C or lower in curing of the epoxy resin and a curing agent having an activation temperature of 130°C or higher.SELECTED DRAWING: Figure 2
Inventors:
Eiji Harima
Yasuaki Arai
Tomotaka Noguchi
Yasuaki Arai
Tomotaka Noguchi
Application Number:
JP2022187304A
Publication Date:
March 01, 2024
Filing Date:
November 24, 2022
Export Citation:
Assignee:
Taiyo Holdings Co., Ltd.
International Classes:
C08G59/06; C08G59/02; C08G59/10; C08G59/40; C08K3/013; C08K3/26; C08K3/36; C08K5/3445; C08L63/00; H05K1/02
Domestic Patent References:
JP2008189760A | ||||
JP2017082022A | ||||
JP2016156019A | ||||
JP2013221120A | ||||
JP2008115293A | ||||
JP2102281A | ||||
JP6107907A |
Foreign References:
WO2016199857A1 | ||||
WO2013183735A1 |
Attorney, Agent or Firm:
Manabu Miyajima
Mari Asano
Kazuma Kojima
Mari Asano
Kazuma Kojima