Title:
THERMOSETTING RESIN MATERIAL
Document Type and Number:
Japanese Patent JP2009001692
Kind Code:
A
Abstract:
To provide a thermosetting resin material containing the thermosetting resin consisting of a compound having a dihydrobenzoxazine ring, excellent in thermal decomposition resistant characteristics and also capable of shortening the curing time of the thermosetting resin under both of atmospheres of oxidative atmosphere and inert atmosphere, and without forming a byproduct during its thermosetting time.
This thermosetting resin material comprises (A) a thermosetting resin having the dihydrobenzoxazine ring and (B) a condensed polycyclic aromatic hydrocarbon resin.
Inventors:
KURIHARA SEI
IDEI HIROSHI
AOYANAGI YOSHIHIRO
OKUMURA NAEKO
IDEI HIROSHI
AOYANAGI YOSHIHIRO
OKUMURA NAEKO
Application Number:
JP2007164725A
Publication Date:
January 08, 2009
Filing Date:
June 22, 2007
Export Citation:
Assignee:
AKEBONO BRAKE IND
International Classes:
C08L61/34; C08K9/04; C08L65/00
Attorney, Agent or Firm:
Shizuo Nakamura
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