Title:
THERMOSETTING RESIN MOLDING
Document Type and Number:
Japanese Patent JPH0463827
Kind Code:
A
Abstract:
PURPOSE:To improve mechanical strengths and heat resistance by compounding a bis(2-oxazoline) compd., an arom. diamine or a dicarboxylic or hydroxycarboxylic acid, and an epoxy resin. CONSTITUTION:A bis(2-oxazoline) comb. [e.g. 2,2'-(1,3-phenylene)bis(2-oxazoline)] in an amt. of 1.0-1.5mol, an arom. diamine or a dicarboxylic or hydroxycarboxylic acid (e.g. 4,4'-diaminodiphenylmethane) in an amt. of 1.0mol, and, if necessary, a curing catalyst in an amt. of 0.05-0.5wt.% based on the sum of the froegoing two compds. are mixed. 95-70 wt.% resulting mixture is compounded with 5-30wt.% epoxy resin (e.g. a glycidyl amine epoxy resin) and, if necessary, a curing agent of the resin in an amt. of 1-50wt.% based on the resin, a filler, etc., and the resulting compsn. is cured.
Inventors:
KIKUMA SHINJI
Application Number:
JP29077790A
Publication Date:
February 28, 1992
Filing Date:
October 30, 1990
Export Citation:
Assignee:
NIHON PORIPENKO KK
International Classes:
C08G59/40; (IPC1-7): C08G59/40
Attorney, Agent or Firm:
Hasegawa Hajime (2 outside)
Next Patent: JPH0463828