Title:
THERMOSETTING RESIN AND RUNNERLESS MOLDING METHOD FOR RUBBER, ETC
Document Type and Number:
Japanese Patent JP3530179
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a thermosetting resin, a runnerless molding device for a rubber, etc., and its manufacturing method which prevents thermal conduction of a high molding temperature of a cavity at the time of molding operation to a runner part by keeping the gate isolated and opened for a longer time, eliminates a material loss to a sprue runner by forming a homogeneous temperature distribution in the runner, and takes effects to improve moldability and alleviate a load to the global environment by attempting to reduce the industrial wastes.
SOLUTION: The device features that, at the time of conducting a heat treatment by installing a movable runner bush 15 which distributes fluidized materials which are maintained at a low temperature in an uncured and unvulcanized condition and supplied from an injection nozzle 31 in a temperature control bush 13 connecting with a gate 4 of a cavity 1 while allowing a free sliding, a heat insulation space A is formed by keeping a distance between the movable runner bush 15 and the gate 4, a valve pin 18 is inserted into the movable runner bush 15 while allowing a free moving, and the gate 4 can be opened and closed by operating the valve pin 18 in connection with the extraction operation of fluidized materials.
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Inventors:
Tanaka, Yoshiteru
Yoshida, Masaaki
Yoshida, Masaaki
Application Number:
JP2002351147A
Publication Date:
May 24, 2004
Filing Date:
December 03, 2002
Export Citation:
Assignee:
SEIKI CORP
International Classes:
B29C45/27; B29C45/26; B29C45/73; B29K101/10; (IPC1-7): B29C45/26; B29C45/73
Attorney, Agent or Firm:
丹羽 宏之 （外１名）