THICK FILM CONDUCTOR, COMPOSITION FOR FORMATION THEREOF AND THICK FILM CONDUCTOR PASTE CONTAINING THE COMPOSITION FOR FORMATION THEREOF

Title:

THICK FILM CONDUCTOR, COMPOSITION FOR FORMATION THEREOF AND THICK FILM CONDUCTOR PASTE CONTAINING THE COMPOSITION FOR FORMATION THEREOF

Document Type and Number:

Japanese Patent JP2022089460

Kind Code:

A

Abstract:

To provide a composition for forming a thick film conductor, preventing a glass component from appearing on a surface of a conductor layer formed on a surface of a glass glazed substrate.SOLUTION: A composition for forming a thick film conductor is to be used as a raw material for a thick film conductor paste through kneading with a vehicle. The composition includes: a conductive powder containing an elemental metal powder or alloy powder selected from a group composed preferably of Au, Ag, Pd and Pt; and a lead-free glass powder containing vanadium and zinc, preferably with a glass transition point of 350°C to 550°C, inclusive. The composition is to be used as a raw material for a thick film conductor formed through calcination on a substrate with a film containing glass formed on a surface thereof.SELECTED DRAWING: None

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Inventors:

AWAGAKUBO SHINGO

Application Number:

JP2020201873A

Publication Date:

June 16, 2022

Filing Date:

December 04, 2020

Export Citation:

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Assignee:

SUMITOMO METAL MINING CO

International Classes:

C03C8/18; C03C8/16; H01B1/22

Attorney, Agent or Firm:

Norihisa Tsujikawa

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