To provide a thick film wiring, which is low in resistance, is superior in a resistance to a thermal oxidation and adhesion to a base material and is provided with a good patterning suitability, and a manufacturing method, which can form simply such the thick film wiring.

A thick film wiring 11, which is formed on a base material 1, is formed of a base conductive layer 13 and a main conductive layer 12, which are laminated from the side of the base material 1, the layer 12 is formed of a layer containing a conductive metal or alloy as its main component and the layer 13 is formed of a layer containing a compound, which consists of the same metal as that constituting the layer 12, as its main component. Moreover, a heat-resisting conductive layer containing a compound, which consists of the same metal as that constituting the layer 12, as its main component is formed on the layer 12 to use as the thick film wiring.