To provide a device capable of measuring thickness of the whole laminated wafer.
A thickness measuring device comprises: thickness measurement optical system and observation optical system of a laminated wafer 1; and a signal processor for calculating thickness of the laminated wafer 1 using a signal outputted from the measurement optical system. The measurement optical system includes: a light source 30 for measurement in a first wavelength region; an objective lens 17 for projecting measuring light to form a light spot; and optical detection means 40 of the reflected light. The observation optical system includes: an illumination light source 41 for emitting illumination light for observation of a second wavelength region different from the first wavelength region; the objective lens 17 for projecting illumination light; and an imaging apparatus 48 for receiving the reflected light to image a two-dimensional image. In an optical path between the common objective lens 17 and the measurement light source and the observation light source, a coupling element 34 having wavelength selectivity for optically connecting the measurement optical system and the observation optical system is arranged. The imaging apparatus 48 images an image superposed with an image of the light spot formed by the measurement light.
TAKIZAWA HIDERO
TADA MITSUHIRO
KUSUSE HARUHIKO
| JP2008083059A | 2008-04-10 | |||
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| WO2011081130A1 | 2011-07-07 |