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Title:
THIN FILM DEPOSITION APPARATUS, AND THIN FILM DEPOSITION METHOD
Document Type and Number:
Japanese Patent JP2016084494
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a thin film deposition apparatus and a thin film deposition method that give high adhesion force between a plastic film and a thin film even under severe temperature conditions and high productivity without causing wrinkles and heat defeats, in a vapor-deposited film formed by depositing various thin films on the surface of the plastic film.SOLUTION: There are provided a thin film deposition apparatus and a thin film deposition method. The thin film deposition apparatus is equipped with a cooling drum and a thin film deposition mechanism arranged oppositely to the cooling drum in a vacuum vessel. A thin film is formed by the thin film deposition mechanism on the surface of a long-sized film conveyed along the surface of the cooling drum. The thin film deposition apparatus is further equipped with a charged particle irradiation device arranged oppositely to the cooling drum upstream of the thin film deposition mechanism in the direction of conveying the long-sized film.SELECTED DRAWING: Figure 1

Inventors:
SAKAMOTO KEITARO
MUROFUSHI YOSHIRO
AIDA HIROKAZU
Application Number:
JP2014216877A
Publication Date:
May 19, 2016
Filing Date:
October 24, 2014
Export Citation:
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Assignee:
TORAY ADVANCED FILM CO LTD
International Classes:
C23C14/02; H01J27/02; H01J37/08
Domestic Patent References:
JP2009263773A2009-11-12
JPH0368754A1991-03-25
JP2006152448A2006-06-15
JPS6414727A1989-01-18
JP2014053410A2014-03-20
Other References:
佐々木徳康、外8名: "リニアイオン源の開発", ULVAC TECHNICAL JOURNAL, vol. Vol.63, JPN6011042443, 2005, JP, pages 26-29
Attorney, Agent or Firm:
Ichijo power