THIN FILM FORMING APPARATUS

Japanese Patent JP2005163079

A

To form a thin film excellent in the uniformity of film thickness on a planar substrate surface in a thin film forming apparatus using a spray thermal decomposition method.

At the time when the surface 3a of a previously heated planar substrate 3 is sprayed with the droplets 2 of a raw material solution comprising a thin film raw material and an organic solvent from a raw material solution spraying means 4 to form a thin film on the surface 3a, the planar substrate 3 is heated by a substrate heating means 6 so as to have a temperature distribution corresponding to the amount of the droplets of the raw material solution to be sprayed per unit area in the surface 3a of the planar substrate 3.

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OKADA HIDEO
IMANAKA TAKAO

JP2003401637A

June 23, 2005

December 01, 2003

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SHARP KK

C23C26/00; (IPC1-7): C23C26/00

Keiichiro Saikyo
Takeshi Sugiyama
Minetarou Hirose

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