Title:
THIN FILM FORMING APPARATUS
Document Type and Number:
Japanese Patent JP3275202
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a thin film forming apparatus which can form a thin film with a uniform thickness even when warpage is generated in a base sheet.
SOLUTION: A semiconductor base sheet 2 is straightforwardly carried while both side edge parts in the width direction are supported by means of carrying rollers and a supporting roller 8 for treating with a liq. is provided over the width direction of the base sheet 2 in the midway of a carrying path constituted therewith. In addition, while the base sheet 2 supported by the supporting roller 8 for treating with a liq. is sucked from the inside through suction holes 11 provided on the peripheral face of the supporting roller 8 for treating with a liq., a treating liq. is jetted zonally on the base sheet 2 from a treating liq. feeding nozzle 3.
Inventors:
Kiyohisa Tateyama
Akira Kawasaki
Akira Kawasaki
Application Number:
JP24922996A
Publication Date:
April 15, 2002
Filing Date:
August 30, 1996
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
B05C5/02; B05C13/00; B05C13/02; B65G13/00; G03F7/30; H01L21/00; H01L21/027; G03F7/16; (IPC1-7): B05C13/02; B65G13/00; H01L21/027
Domestic Patent References:
| JP5277418A | ||||
| JP2144312A | ||||
| JP423713A | ||||
| JP58166543U | ||||
| JP3501702A |
Attorney, Agent or Firm:
Kikuhiko Nakamoto