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Title:
THIN FILM-FORMING POLYMER
Document Type and Number:
Japanese Patent JP2000026548
Kind Code:
A
Abstract:

To prepare a thin film-forming functional polymer usable for hotoresist, or the like and having dicarboxylic acid half ester groups by including a specific hydrolysis resistant polymer ingredient and a specific heat-resistant polymer ingredient.

This thin film-forming functional polymer having 1,2-dicarboxylic acid half ester groups is prepared by including (A) 1-99 mol.% (pref. 5-50 mol.%) polymer ingredient having acid lability and hydrolytic resistance, selected from compounds of formula I, II [(n) is 0-3; R is 2-tetrahydrofuranyl, 2- tetrahydropyranyl, or the like], or the like and (B) 99-1 mol.% heat-resistant polymer ingredient of formula III and IV [R2 to R4 are each a 1-6C alkyl, a 1-6C alkoxy, or the like; R5 is H or a 1-6C alkyl; X is Si or Sn; Y is O or NH] and, optionally, (C) 1-50 mol.% heat-resistant polymer ingredient of formula V (R6 to R9 are each H, a 1-6C alkyl, a halogen, or the like).


Inventors:
HIEN STEFAN DR
SEBALD MICHAEL DR
Application Number:
JP11701299A
Publication Date:
January 25, 2000
Filing Date:
April 23, 1999
Export Citation:
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Assignee:
SIEMENS AG
International Classes:
G03F7/033; C08F222/16; C08F222/20; C08F230/04; C08F230/08; C08F232/04; C08F232/08; G03F7/039; G03F7/075; (IPC1-7): C08F222/16; C08F230/04; C08F232/08; G03F7/033
Attorney, Agent or Firm:
Iwao Yamaguchi