Title:
薄膜インダクタ、コイル部品および薄膜インダクタの製造方法
Document Type and Number:
Japanese Patent JP7345253
Kind Code:
B2
Abstract:
To increase joint strength of a solder joint without increasing a size of an electrode in a method of manufacturing a thin film inductor, a coil component used in the thin film inductor, and a thin film inductor.SOLUTION: A thin film inductor 100 includes: an insulating block 1 surrounding a coil block 11 having a coil pattern; and electrode pads 2, 3 exposed to an outside of the insulating block 1, connected to the coil block 11. The electrode pads 2, 3 have pad surfaces 2s and others formed along side surfaces of the insulating block 1. On the pad surface, groove-shaped pad recesses 2a, 2b, 2c, 2d and pad recesses 3a, 3b, 3c, 3d are formed along a stacking direction of the coil patterns.SELECTED DRAWING: Figure 1
Inventors:
Yutaka Take
Makoto Yoshida
Vinarao Anthony Raymond Merado
King Shinmu
Makoto Yoshida
Vinarao Anthony Raymond Merado
King Shinmu
Application Number:
JP2018248271A
Publication Date:
September 15, 2023
Filing Date:
December 28, 2018
Export Citation:
Assignee:
SAE Magnetics(H.K.)Ltd.
International Classes:
H01F27/29; H01F17/00; H01F41/04; H01F41/10
Domestic Patent References:
| JP2018147961A | ||||
| JP2018182039A | ||||
| JP2008140836A | ||||
| JP2018056472A | ||||
| JP2012222252A | ||||
| JP2018190828A | ||||
| JP11068284A | ||||
| JP2015115498A | ||||
| JP2017216428A | ||||
| JP2018170430A |
Foreign References:
| WO2011155241A1 | ||||
| WO2017010009A1 |
Attorney, Agent or Firm:
Kazuyuki Shirai
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