Title:
THIN FILM RESISTANCE FOR MEASUREMENT AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JPH07263208
Kind Code:
A
Abstract:
PURPOSE: To provide a thin-film resistance, having a good corrosion resistance and capable of simple manufacturing by depositing an intermediate layer to a glass substrate, a metallic film on it by evaporation, structuring the metallic film by sputter-etching, and depositing only a protective film to the metal film. CONSTITUTION: A structurized platinum or platinum film is deposited on a substrate 5. The platinum thin film 3 is connected electrically to platinum thin films 1 and 2. The platinum thin films 1 and 2 are used as the terminal face. When glass is used for the substrate 5, first an Al2 O3 intermediate layer which is far thinner that the platinum thin film is deposited, and the platinum thin film is evaporated. The evaporated platinum thin film 3 is processed and structurized by sputter etching. The film or the protective layer of SiOx deposited to the thin film resistance 3 at the final process stage is not deposited to all of the thin film resistance, but only the region between the line 8 and 9.
Inventors:
RARUFU FUTSUKU
Application Number:
JP6443894A
Publication Date:
October 13, 1995
Filing Date:
March 09, 1994
Export Citation:
Assignee:
MANNESMANN AG
International Classes:
H01C17/02; H01C7/00; H01C17/12; (IPC1-7): H01C17/12; H01C7/00; H01C17/02
Attorney, Agent or Firm:
Okuyama Nao