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Title:
THIN-FILM TRANSISTOR FORMED ON METAL-THIN-FILM SUBSTRATE
Document Type and Number:
Japanese Patent JP2004048005
Kind Code:
A
Abstract:

To obtain a TFT having high performance equal to that of a TFT manufactured by utilizing a laser annealing method, in manufacturing a flexible-substrate TFT by utilizing a solid phase crystallization method.

The manufacturing of a flexible-substrate TFT has a process 302 for feeding a metal-thin-film substrate having a flat surface, a process 304 for subjecting the surface of the substrate to planarization processing, a process 306 for laminating an insulation layer on the planarized surface of the metal-thin-film substrate, a process 308 for laminating an amorphous silicon layer on the insulation layer, a process 310 for annealing the amorphous silicon layer by a solid-phase crystallization method to form a polycrystal silicon layer, a process 312 for thermally growing a gate insulation film on the polycrystal silicon layer, and a process 314 for forming the gate region, the source region, and the drain region of a transistor.


Inventors:
ADACHI MASAHIRO
VOUTSAS APOSTOLOS T
HARTZELL JOHN W
Application Number:
JP2003191696A
Publication Date:
February 12, 2004
Filing Date:
July 04, 2003
Export Citation:
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Assignee:
SHARP KK
International Classes:
G02F1/1368; G11C13/00; H01L21/20; H01L21/336; H01L27/24; H01L27/32; H01L29/49; H01L29/786; H01L45/00; H01L51/00; H01L21/77; H01L21/84; (IPC1-7): H01L29/786; G02F1/1368; H01L21/20; H01L21/336
Attorney, Agent or Firm:
Hiroshi Maeda
Hiroshi Koyama
Yuji Takeuchi