Title:
薄い平面の熱拡散装置
Document Type and Number:
Japanese Patent JP4095674
Kind Code:
B2
Abstract:
A heat spreading apparatus includes a first planar body for attachment to a heat generating surface which results in a hot region and a cool region on the first planar body. A second planar body connected to the first planar body is used to define a void between the first planar body and the second planar body. The void includes a planar capillary path and a non-capillary region. A fluid positioned within the void distributes heat by vaporizing the fluid from the planar capillary path in the hot region, condensing the fluid in the non-capillary region in the cool region, and moving from the non-capillary region to the planar capillary path in the hot region through capillarity.
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Inventors:
Thomas daniel lee
Application Number:
JP52372898A
Publication Date:
June 04, 2008
Filing Date:
November 17, 1997
Export Citation:
Assignee:
Novel Concepts Incorporated
International Classes:
F28D15/00; F28D15/02; H01L23/427; H05K7/20
Domestic Patent References:
| JP6029683A | ||||
| JP3079992A |
Foreign References:
| US4118756 | ||||
| US5427174 |
Attorney, Agent or Firm:
Minoru Nakamura
Fumiaki Otsuka
Shishido Kaichi
Hideto Takeuchi
Toshio Imajo
Nobuo Ogawa
Village shrine Atsuo
Fumiaki Otsuka
Shishido Kaichi
Hideto Takeuchi
Toshio Imajo
Nobuo Ogawa
Village shrine Atsuo