To solve the problem that a high frequency coil is not effectively utilized for an electronic/electric apparatus or a wireless power source, etc., since thinning and the improvement of a lamination factor are extremely difficult because of the structure of a litz wire when the conventional litz wire is wound around the high frequency coil.

A plurality of thin independent fusing conductive wires are arranged in a coil width direction or the vertical direction of the coil width direction. An arrayed winding coil is obtained, while controlling tension in response to the feeding of the respective conductive wires, so as to obtain the thin high frequency coil with the high lamination factor.