Title:
THREE-DIMENSIONAL MOLDING APPARATUS
Document Type and Number:
Japanese Patent JP2023167470
Kind Code:
A
Abstract:
To provide a three-dimensional molding apparatus capable of enhancing quality of a three-dimensional molded object.SOLUTION: A three-dimensional molding apparatus comprises: a moving mechanism for relatively moving at least one of a first molding head and a second molding head and a stage; and a controller for controlling the first molding head, the second molding head, and the moving mechanism. The controller allows the first molding head to execute molding of a first calibration element 310A on the stage, and allows the second molding head to execute molding of a second calibration element 320A on the stage. The first calibration element 310A has a plurality of molding line 310A1 arranged with a first interval W1 in a first direction on the stage. The second calibration element 320A has a plurality of molding lines 320A1 arranged with a second interval W2 wider than the first interval W1 in the first direction on the stage.SELECTED DRAWING: Figure 3
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Inventors:
HASHIZUME KEITARO
Application Number:
JP2022078678A
Publication Date:
November 24, 2023
Filing Date:
May 12, 2022
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
B29C64/393; B29C64/118; B29C64/236; B33Y30/00; B33Y40/00; B33Y50/02
Attorney, Agent or Firm:
Satoshi Nakai
Hiroki Matsuoka
Masayuki Imamura
Hiroki Matsuoka
Masayuki Imamura