Title:
TILE CONSTRUCTION METHOD AND ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JP2022013755
Kind Code:
A
Abstract:
To provide a tile construction method enhancing bonded-tile durability to vibration and linear expansion of a construction surface, and excellent in stain resistance of an adhesive layer.SOLUTION: A tile construction method comprises bonding a tile on a construction surface with an adhesive composition whose storage elastic modulus at 23°C after cure is 1.5 MPa to 10 MPa. The adhesive composition contains at least one of a polymer having a cross-linkable silyl group, and an epoxide resin.SELECTED DRAWING: Figure 1
Inventors:
ITO TORU
SAWANO SHIN
KITAMURA KENJI
KONTA TETSUSHI
SAWANO SHIN
KITAMURA KENJI
KONTA TETSUSHI
Application Number:
JP2021101011A
Publication Date:
January 18, 2022
Filing Date:
June 17, 2021
Export Citation:
Assignee:
PANASONIC IP MAN CORP
International Classes:
C09J163/00; C09J11/08; C09J133/04; C09J171/00; C09J201/00; E04F13/08
Attorney, Agent or Firm:
Patent business corporation Hokuto patent office
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