Title:
タイル模様付け装置
Document Type and Number:
Japanese Patent JP7087416
Kind Code:
B2
Abstract:
To provide a tile pattern fitting device in which the service live of a wire is made longer.SOLUTION: A tile pattern fitting device 100 is provided at a tile production device 10 for producing a tile from raw material.The tile pattern fitting device 100 comprises: a wire 120 for peeling the surface of a molded body fed from an outlet 42 of a molding machine 30 for molding the raw material; and a feeding device 200 for feeding the wire 120.SELECTED DRAWING: Figure 3
Inventors:
Furukawa Masato
Hirokazu Miura
Hirokazu Miura
Application Number:
JP2018015637A
Publication Date:
June 21, 2022
Filing Date:
January 31, 2018
Export Citation:
Assignee:
Sekisui House Co., Ltd.
International Classes:
B28B3/20; B28B11/08
Domestic Patent References:
| JP2011168047A | ||||
| JP5309630A | ||||
| JP60165206A | ||||
| JP60002306A | ||||
| JP2000313007A | ||||
| JP10034639A |
Attorney, Agent or Firm:
Makoto Onda
Hironobu Onda
Hironobu Onda