タイル材の剥離方法 - TAKENAKA CORPORATION

Title:

タイル材の剥離方法

Document Type and Number:

Japanese Patent JP7291571

Kind Code:

B2

Abstract:

To provide a peeling method of a tile material for heightening workability and certainty of taking the tile material for next use.SOLUTION: A peeling method of a tile material 20 includes steps of: partitioning a peeling object region 60 by cutting a joint part 40 positioned between tile material parts 20 of one part from a part corresponding to the joint part 40 out of a substrate material 50; forming a through-hole 61 in the peeling object region 60 by drilling the tile material 20 and the substrate material 50 corresponding to the peeling object region 60 after the partitioning step; and peeling the tile material 20 corresponding to the peeling object region 60 from a skeleton body 10, by locking a locking part 81 to the substrate material 50 corresponding to the peeling object region 60 by inserting a peeling tool 80 into the through-hole 61 after the partitioning step and the forming step, and by moving the locking part 81 to the direction separating from the skeleton body 10 following pressing force to the skeleton body 10 by a pressing part 82 in the locked state.SELECTED DRAWING: Figure 5

Inventors:

Sho Morita
Takahiro Suzuki
Hiroyuki Yamashita
Masatoshi Shinchi
Michihiko Matsubara
Masato Yamamoto
Kan Hasegawa
Shingo Yoshida
Satoshi Kake

Application Number:

JP2019148891A

Publication Date:

June 15, 2023

Filing Date:

August 14, 2019

Export Citation:

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