Title:
挿抜性に優れた錫めっき銅合金端子材
Document Type and Number:
Japanese Patent JP5263435
Kind Code:
B1
Abstract:
To provide tin-plated copper-alloy material for terminal having an excellent insertion/extraction performance by reducing dynamic friction coefficient to 0.3 or less with bringing out an excellent electrical-connection characteristic. Tin-plated copper-alloy material for terminal in which: a Sn-based surface layer is formed on a surface of a substrate made of Cu alloy, and a Cu-Sn alloy layer is formed between the Sn-based surface layer and the substrate; the Cu-Sn alloy layer is an alloy layer containing Cu 6 Sn 5 as a major proportion and having a compound in which a part of Cu in the Cu 6 Sn 5 is substituted by Ni and Si in the vicinity of a boundary face at the substrate side; an average thickness of the Sn-based surface layer is 0.2 µm or more and 0.6 µm or less; an oil-sump depth Rvk of the Cu-Sn alloy layer is 0.2 µm or more; an area rate of the Cu-Sn alloy layer exposed at a surface of the Sn-based surface layer is 10% or more and 40% or less; and dynamic friction coefficient is 0.3 or less.
Inventors:
Yuki Taniuchi
Naoki Kato
Kenji Kubota
Naoki Kato
Kenji Kubota
Application Number:
JP2012177937A
Publication Date:
August 14, 2013
Filing Date:
August 10, 2012
Export Citation:
Assignee:
Mitsubishi Materials Corporation
International Classes:
C25D7/00; C25D5/10; C25D5/50; H01R13/03
Domestic Patent References:
| JP2007100220A | ||||
| JP200763624A |
Attorney, Agent or Firm:
Masakazu Aoyama