タイヤ−ホイールアセンブリの組立システムおよび方法

Title:

タイヤ−ホイールアセンブリの組立システムおよび方法

Document Type and Number:

Japanese Patent JP5827754

Kind Code:

B2

Abstract:

An apparatus for processing a tire and a wheel for forming a tire-wheel assembly is disclosed. The apparatus includes at least one linear mounter sub-station that couples the tire with the wheel for forming the tire-wheel assembly. The apparatus also includes a transporting device that transports one of the wheel and the tire along a linear path that traverses the at least one linear mounter sub-station. The component of the at least one linear mounter sub-station resists, but does not prevent, movement of one of the tire and the wheel relative the other of the tire and the wheel along the linear path in order to spatially manipulate one of the tire and the wheel relative the other of the tire and the wheel in order to at least partially couple the tire with the wheel for forming the tire-wheel assembly. A method is also disclosed.

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Inventors:

Lawson, Lawrence Jay
Clark, Barry Alan
Reese, Robert
Niazi, Ramsey Richard

Application Number:

JP2014530829A

Publication Date:

December 02, 2015

Filing Date:

September 14, 2012

Export Citation:

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