Title:
【発明の名称】ラップアラウンドラベルを貼付するための接着剤系
Document Type and Number:
Japanese Patent JPH11508616
Kind Code:
A
Abstract:
PCT No. PCT/EP96/02753 Sec. 371 Date Dec. 22, 1997 Sec. 102(e) Date Dec. 22, 1997 PCT Filed Jun. 24, 1996 PCT Pub. No. WO97/01483 PCT Pub. Date Jan. 16, 1997The invention is an adhesive system for applying wrap around labels to containers. The system comprises a hotmelt pick-up adhesive which is active at the temperature which the label is applied and loses its bonding ability after the adhesive sets and an overlap adhesive for bonding the label overlap. At its application temperature, the pick-up adhesive has significantly higher adhesiveness, measured at its application temperature than at its conventional storage temperature. In addition, the adhesive preferably has a greater affinity for the label than for the container bearing the label. Consequently, the label can be easily removed from the hollow body without leaving residues of adhesive. If, nevertheless, a residual adhesive should remain on the hollow body, it can be dissolved by an alkaline solution.
Inventors:
Hexmann, Marx
Purkner, Eckhart
Klingberg, Wolfgang
Hehrftarkamp, Bernhard
Onusite, Hermann
Ralph Gossen
Purkner, Eckhart
Klingberg, Wolfgang
Hehrftarkamp, Bernhard
Onusite, Hermann
Ralph Gossen
Application Number:
JP50416697A
Publication Date:
July 27, 1999
Filing Date:
June 24, 1996
Export Citation:
Assignee:
HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN
International Classes:
B65C3/16; B65C9/20; C09J7/21; C09J7/38; C09J11/06; C09J123/00; C09J123/02; C09J129/02; C09J133/02; C09J5/00; C09J133/04; C09J167/00; C09J167/02; C09J191/06; C09J201/00; (IPC1-7): C09J123/00; C09J5/00; C09J11/06; C09J129/02; C09J133/02; C09J133/04; C09J167/02; C09J191/06; C09J201/00
Attorney, Agent or Firm:
Aoyama Ryo (1 person outside)