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Title:
【発明の名称】抗漏水縫合構造物、抗漏水縫合構造の形成方法及び縫合構造物の熱処理装置
Document Type and Number:
Japanese Patent JP3253305
Kind Code:
B2
Abstract:
A seamed structure formed with seams which are soak- and leak-resistant to be suitable for three-dimensionally shaped, processed products such as shoes and the like, and a method of forming the same. The seamed structure has a feature in that a face material and a back material are seamed along seam lines through a hot melt adhevise resin layer, sewing needle holes defining the seam lines are filled with a part of a resin of the hot melt adhesive resin layer, and the face material is water-proof. The seamed structure can be prepared by a method which includes the following processes: (A) a process of preparing a precursor seamed layer structure by sewing the water-proof face material and the back material at least along the seam lines with a specified hot melt adhesive resin sheet between them; (B) while pressing the seamed layer structure by means of surfaces of a specified pressure plate body, applying sufficient high-frequency voltage to melt the hot melt adhesive resin sheet, thus fluidizing only the hot melt adhesive resin sheet and having a part of the resin sheet enter and fill into the sewing needle holes which constitute the seam lines. An embodiment of a method of forming the seamed structure is disclosed together with a high-frequency heating processing device, which is suitable for processing of shoes.

Inventors:
Masami Kamiya
Application Number:
JP53972797A
Publication Date:
February 04, 2002
Filing Date:
November 20, 1996
Export Citation:
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Assignee:
ASAHI KASEI KABUSHIKI KAISHA
International Classes:
A43B9/02; A43D11/12; (IPC1-7): B29C65/72; A43B9/02; A43B9/20; A43D21/00; B29D31/50; D05B1/26; D06H5/00
Domestic Patent References:
JP892868A
JP6246076A
JP5959322U
JP3918384B1
Other References:
【文献】登録実用新案3007652(JP,U)
Attorney, Agent or Firm:
Takashi Ishida (1 person outside)