Title:
MANUFACTURING FOR RESIN SEALED SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH0823006
Kind Code:
A
Abstract:
PURPOSE: To provide a resin injection step for a whole-body resin sealed semiconductor device, in which a part of a base board put between holding pins is coated easily with a reliable insulating layer.
CONSTITUTION: A given part to be put between holding pins 7 is coated previously with an insulating film 5 so that the holding pin 7 doesn't need removing in a molding resin injecting step. The insulating film 5 can be formed by bonding an insulating film or by impregnating the chip with a liquid resin and hardening the resin.
Inventors:
MARUYAMA ATSUSHI
Application Number:
JP15555194A
Publication Date:
January 23, 1996
Filing Date:
July 07, 1994
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD
International Classes:
H01L21/56; (IPC1-7): H01L21/56
Attorney, Agent or Firm:
Iwao Yamaguchi
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