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Patent Searching and Data


Title:
THERMOPLASTIC RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH069866
Kind Code:
A
Abstract:

PURPOSE: To provide a thermoplastic resin composition holding its stable physical properties even when used for long periods under high temperatures, and reduced in thermal discoloration by compounding a polyamide resin and a polyphenylene ether resin with a specific organic phosphite compound.

CONSTITUTION: The composition comprises (A)95-5wt.% of a polyamide resin (e.g. nylon 6), (B) 5-95wt.% of a polyphenylene ether resin, and (C) an organic phosphite compound of the formula (R is 1-9C alkyl) [e.g. bis(2,6-di-t-butyl-4- methylphenyl)pentaerythritol diphosphite] in an amount of 0.001-10 pts.wt. per 100 pts.wt. of the total amount of the components A and B. The component B is preferably 2,6-dimethylphenol homopolymer, the copolymer of a major amount of 2.6-xylenol with a minor amount of 3-methyl-6-t-butylphenol, etc. Maleic acid, etc., is preferably added as a compatibility-improving agent between the components A and B to the composition.


Inventors:
IKENAGA MICHIHIKO
SUZUKI YASUAKI
IJICHI YASUTO
Application Number:
JP16889592A
Publication Date:
January 18, 1994
Filing Date:
June 26, 1992
Export Citation:
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Assignee:
SUMITOMO CHEMICAL CO
International Classes:
C08K5/524; C08L71/12; C08L77/00; (IPC1-7): C08L71/12; C08K5/524; C08L71/12; C08L77/00
Attorney, Agent or Firm:
Mitsuhiro Moroishi (1 person outside)