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Patent Searching and Data


Title:
LEAD FRAME AND TAB TAPE
Document Type and Number:
Japanese Patent JPH07115169
Kind Code:
A
Abstract:

PURPOSE: To avoid the deterioration of the position accuarcy of the tips of inner leads with an advanced fine structure by a method wherein a lead fixing tape composed of a metallic material layer and an electrically insulating adhesive layer is applied over a plurality of the leads with the adhesive layer.

CONSTITUTION: A metallic material layer 12 to which a plating layer 14 is applied and an adhesive layer 16 are bonded to each other to provide a lead fixing tape 20. This fixing tape 20 is applied over a plurality of inner leads 10 with the adhesive layer 16. The adhesive layer 16 and the metallic material layer 12 of the lead fixing tape 20 are so bonded as to have the edge parts of the adhesive layer 16 provided outside the edge parts of the metallic material layer 12. With this constitution, deformation caused by moisture absorption expansion, heat shrinkage, difference in heat expansion coefficient, etc., can be avoided and the deterioration of the position accuracy of the tips of the inner leads with an advanced fine structure can be avoided.


Inventors:
KURAISHI FUMIO
WADA NORIO
HAYASHI MAMORU
Application Number:
JP25793393A
Publication Date:
May 02, 1995
Filing Date:
October 15, 1993
Export Citation:
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Assignee:
SHINKO ELECTRIC IND CO
International Classes:
H01L21/60; H01L23/50; (IPC1-7): H01L23/50; H01L21/60
Attorney, Agent or Firm:
Takao Watanuki (1 outside)



 
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