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Patent Searching and Data


Title:
COOLING METHOD FOR POWER SEMICONDUCTOR
Document Type and Number:
Japanese Patent JPS5839045
Kind Code:
A
Abstract:

PURPOSE: To enable to cool a power transistor and to simply mount or dismount the transistor while a heat pipe is mounted in a method of cooling the power semiconductor used for a power source circuit mainly for power transistor, thyristor by inserting, sealing one end of the pipe to the cap and disposing the other end side in a duct, in which cooling air flows.

CONSTITUTION: One end A of a heat pipe which is slightly larger in diameter than a cap 2 is sealed by a transistor 1, and the other end B is sealed ordinarily by a heat pipe forming material. A heat resistant plastic is sealed between the base 3 contacted with a wick and the tubular wall of the pipe. A hole 11 which is slightly larger in diameter than the pipe 5 is formed at the tubular wall of a duct 9 in which cooling air flows in a direction designated by broken lines by the operation of a fan 10, part of the pipe 5 is disposed in the duct 9 through the hole, and a condenser is cooled by air which flows through the duct.


Inventors:
NISHI KENICHI
SUZUKI FUSAE
Application Number:
JP13814681A
Publication Date:
March 07, 1983
Filing Date:
September 02, 1981
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H05K7/20; H01L23/427; (IPC1-7): H01L23/46; H05K7/20
Attorney, Agent or Firm:
Shinichi Kusano