Title:
【発明の名称】キャリヤサブストレート
Document Type and Number:
Japanese Patent JP2002532840
Kind Code:
A
Abstract:
A carrier substrate for carrying objects subjected to elevated temperatures comprises at least a grid part and a border part. The grid part includes grid elements having end portions provided with holes. The end portions partly extend outside the border part via sleeves in the border part. The grid elements and the border part are interconnected solely by interengaging connection portions comprising the first end portions and metal wires extending through the holes.
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Inventors:
Petrus Ye Sae Saphan del Linden
Ian P Mayer
Ian P Mayer
Application Number:
JP2000588410A
Publication Date:
October 02, 2002
Filing Date:
November 29, 1999
Export Citation:
Assignee:
Konin Krekka Philips Electronics NV
International Classes:
C21D1/00; C21D9/00; F27D3/12; F27D5/00; H01J9/14; (IPC1-7): H01J9/14; C21D1/00; F27D3/12
Attorney, Agent or Firm:
Akihide Sugimura (2 outside)