Title:
【発明の名称】セラミック積層回路基板
Document Type and Number:
Japanese Patent JP2610487
Kind Code:
B2
Abstract:
The present invention provides a ceramic laminated circuit substrate which is less in fluctuation of degree of shrinkage at firing and is less in voids and is suitable for formation of functional modules. This substrate comprises a conductor layer (3) and a plurality of ceramic insulating layers (2B) wherein said ceramic insulating layers include at least one fiber-containing composite ceramic insulating layer. The present invention further provides a method for making this substrate which comprises preparing fiber-containing composite green sheets by adding to a green sheet raw material at least one of whiskers, glass filaments and chopped strands as fibers (1A), laminating these fiber-containing composite green sheets in such direction that their casting directions are different together with green sheets containing no fibers to form a laminate and firing this laminate.
Inventors:
Koichi Shinohara
Suzuki Hideo
Satoru Ogihara
Arakawa Hideo
Suzuki Hideo
Satoru Ogihara
Arakawa Hideo
Application Number:
JP14335088A
Publication Date:
May 14, 1997
Filing Date:
June 10, 1988
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
H05K1/03; B32B18/00; C04B35/80; C04B35/82; H01L21/48; H01L23/15; H01L23/498; H01L23/538; H05K1/02; H05K3/46; (IPC1-7): H05K3/46; H05K1/03
Domestic Patent References:
| JP57206085A | ||||
| JP62173742A | ||||
| JP6289344A | ||||
| JP6010698A | ||||
| JP60177695A | ||||
| JP58194207A | ||||
| JP54149708A | ||||
| JP61245594A | ||||
| JP1140792A | ||||
| JP1269903A | ||||
| JP5732036B2 |
Attorney, Agent or Firm:
Tatsuyuki Unuma (1 outside)