PURPOSE: To provide an electronic part mounting method by which the part mounting time can be shortened by simultaneously performing thermocompression bonding of all electronic parts.

CONSTITUTION: In an electronic part mounting method in which electronic parts 5 are mounted on a printed wiring board 1 by thermocompression bonding and curing a bonding agent interposed between the board 1 and parts 5 while the parts 5 are placed on the board 1, the thermocompression bonding is performed after tentatively fixing the parts 5 to be mounted at a prescribed position on the board 1. The tentatively fixing method includes a method using air suction, a method in which the parts 5 are stuck to the board 1 at the end section of a sheet- or belt-like tentatively fixing means by putting the tentatively fixing means on the parts 5, a method using weights, etc.