Title:
DEVICE FOR TREATING SEMICONDUCTOR WAFER
Document Type and Number:
Japanese Patent JPS6052035
Kind Code:
A
Abstract:
A transport apparatus (10) for moving semiconductor wafers (12) between a cassette (15) and a process station (16), and from the process station to another cassette (17). A horizontally movable input shuttle (20) has three wafer holding elements (30, 32, 34) formed thereon. In a first position of the shuttle the second and third holding elements overly a pair of vertically movable lift plates (60), and in a second position of the shuttle the first and second holding elements overly the lift plates. A lifting mechanism (28) at the process station lifts wafers off the input shuttle when the shuttle is in its second position and deposits them on an output shuttle (22) which is essentially identical to the input shuttle. Wafers are lifted off the holding elements by the lift plates whenever the shuttle reaches either position, after which the lift plates replace the wafers on the shuttle and the shuttle is again moved. In this manner, a succession of wafers are moved stepwise from one cassette to the process station, and then to the other cassette. In accordance with one aspect of the invention the shuttle and the lift plates undergo harmonic motion to minimize relative motion between the wafers and the shuttle and lift members due to inertia.
Inventors:
POURU OUKII SUTAMUBU
KARUBIN JIYOOJI TEIRAA
KARUBIN JIYOOJI TEIRAA
Application Number:
JP10187784A
Publication Date:
March 23, 1985
Filing Date:
May 22, 1984
Export Citation:
Assignee:
EATON CORP
International Classes:
B65H3/32; B65G1/00; B65G1/04; B65G1/07; B65G1/137; B65G25/06; B65G49/07; B65G57/00; B65H1/18; B65H1/28; H01L21/67; H01L21/677; (IPC1-7): B65G1/07; B65G57/00; B65H1/18; B65H3/32; H01L21/68
Attorney, Agent or Firm:
Wakabayashi Tadashi