Title:
【発明の名称】クランプ装置
Document Type and Number:
Japanese Patent JP3079503
Kind Code:
B2
Abstract:
A clamping device used in, for instance, a bonding machine, using a piezo-electric element for opening and closing a pair of clamping claws for holding, for instance, bonding wires in between. The clamping device includes a pressure adjustment screw which applies a preparatory pressure to the piezo-electric element via a contact plate, and the contact plate is connected, via flexible sections which are capable of expansion and contraction, to a screw attachment with which the pressure adjustment screw is screw-engaged.
Inventors:
Kouichi Harada
Minoru Torihata
Takayuki Iiyama
Minoru Torihata
Takayuki Iiyama
Application Number:
JP25951095A
Publication Date:
August 21, 2000
Filing Date:
September 13, 1995
Export Citation:
Assignee:
Shinkawa Co., Ltd.
International Classes:
B25B5/06; H01L21/60; B25B9/00; H01L41/09; (IPC1-7): H01L21/60
Domestic Patent References:
| JP6260523A |
Attorney, Agent or Firm:
Yoshinori Tanabe