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Title:
RADIATION POLYMERIZABLE MIXTURE AND PRODUCTION OF SOLDER RESIST MASK
Document Type and Number:
Japanese Patent JPH0627666
Kind Code:
A
Abstract:

PURPOSE: To provide a radiation polymerizable mixture having improved corrosion resistance and dielectric strength.

CONSTITUTION: The radiation polymerizable mixture contains the following components. They are (a) a compound having at least one of free radical polymerizable group, (b) a polymer like binder soluble in an aq. alkaline solution but insoluble in water, (c) a fine particulate mineral pigment consisting essentially of silicic acid or a silicate, which has reactivity itself and a surface improved by the reaction with a compound containing a free radical crosslinkable or thermal cosslinkable group, (d) a polymerization initiator activated by radiation or a combination of polymerization initiators and (e) a compound capable of being crosslinked itself, with the binder (b) or with the compound (a) by heating.


Inventors:
GERARUTO SHIYUUTSUE
RUDORUFU DETSUKAA
YURUGEN RINGUNAU
Application Number:
JP33917892A
Publication Date:
February 04, 1994
Filing Date:
December 18, 1992
Export Citation:
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Assignee:
HOECHST AG
International Classes:
C08F2/44; C08F2/50; C08F257/02; G03F7/004; G03F7/027; G03F7/028; G03F7/038; G03F7/075; H05K3/28; (IPC1-7): G03F7/038; G03F7/004; G03F7/028; G03F7/075; H05K3/28
Attorney, Agent or Firm:
Kazuo Sato (2 outside)



 
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