Title:
【発明の名称】電子回路被覆製造用組成物
Document Type and Number:
Japanese Patent JP2888557
Kind Code:
B2
Inventors:
ARAN ARUFURETSUDO AIZENBURAUN
UEZUREI KURINTON BUROTSUKAA
UEZUREI KURINTON BUROTSUKAA
Application Number:
JP26228289A
Publication Date:
May 10, 1999
Filing Date:
October 09, 1989
Export Citation:
Assignee:
ARUBEMAARU CORP
International Classes:
C09D179/08; C08G73/10; G02B7/04; G03F7/09; H01B3/30; H01L21/312; (IPC1-7): C09D179/08; H01L21/312
Attorney, Agent or Firm:
Heiyoshi Odashima