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Patent Searching and Data


Title:
BONDED MOLDINGS
Document Type and Number:
Japanese Patent JPH071672
Kind Code:
A
Abstract:

PURPOSE: To produce bonded moldings at a low cost while freely selecting the elastic characteristics thereof by a method wherein a nonwoven fabric mainly composed of vinyl chloride fibers is disposed on one surface of a substrate, both are wrapped in a facing vinyl chloride sheet, and the end part thereof is fused and bonded.

CONSTITUTION: A nonwoven fabric 2 mainly composed of vinyl chloride fibers is disposed on one surface of a substrate 1, such as a resin plate. The substrate 1 and the nonwoven fabric 2 are wrapped in a facing vinyl chloride sheet 3. An end part 4 is fused and bonded for obtaining a bonded molded piece 5. The mixing ratio of the vinyl chloride fibers is preferably not less than 50%. The vinyl chloride fibers are preferably mixed with acrylic fibers and nylon fibers that are easily fused and bonded by a high frequency. As a method for obtaining the nonwoven fabric, a needle punching method, a water flow confounding method, a partially bonding method by thermally embossing, or other various methods can be adopted.


Inventors:
OSHIMA MASAHARU
AOKI AKIRA
Application Number:
JP14796293A
Publication Date:
January 06, 1995
Filing Date:
June 18, 1993
Export Citation:
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Assignee:
MITSUBISHI RAYON CO
International Classes:
B32B3/02; B32B27/12; (IPC1-7): B32B27/12; B32B3/02