PURPOSE: To provide an IC socket constructed such that an IC package placed on a group of contact pins can be lowered to a predetermined location properly and rapidly with less operation force against strong upward resilience by the contact pins.

CONSTITUTION: A cover which presses downwardly an IC package 10 placed on a group of contact pins 6 in a socket body 1 and hereby electrically connects the contact pins and the IC package is constructed with a main cover 2 journaled to the socket body, a press cover 3 adapted to be vertically movable in a predetermined range with respect to the main cover, and a lever cover 4 journaled to the main cover for pressing the press cover downwardly.