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Patent Searching and Data


Title:
HYBRID INTEGRATED CIRCUIT DEVICE
Document Type and Number:
Japanese Patent JPH0722577
Kind Code:
A
Abstract:

PURPOSE: To provide a hybrid integrated circuit device in which a wiring circuit board connected to a hybrid integrated circuit is easily supported and which facilitates the size reduction of the whole unit.

CONSTITUTION: A hybrid integrated circuit 10 which is composed of an insulating board, a plurality of circuit chips which are fixed to the insulating board with conducting paths having required patterns therebetween and signal and power outer lead terminals 13 and 14 which are connected to required positions to which the conducting paths are extended and a wiring circuit board 20 which has a plurality of circuit chips 21 at least on one of the main surfaces and is connected to the hybrid integrated circuit 10 are provided. The power outer lead terminal 14 has two systems of terminal parts which are first terminal part 14A and second terminal part 14B. The first terminal part 14A is directly connected to a lead wiring 30 extended from an external circuit and the second terminal part 14B is connected to the wiring circuit board 20.


Inventors:
SAKAMOTO NORIAKI
OKAWA KATSUMI
Application Number:
JP15711393A
Publication Date:
January 24, 1995
Filing Date:
June 28, 1993
Export Citation:
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Assignee:
SANYO ELECTRIC CO
International Classes:
H01L25/07; H01L25/18; H05K1/14; H05K3/34; (IPC1-7): H01L25/18
Attorney, Agent or Firm:
Takuji Nishino