PURPOSE: To obtain a connection terminal laminated structure of a circuit board generating no crack due to thermal expansion difference by forming a fragile coating layer on the upper surface of a first circuit board and laminating a connection terminal composed of a metal on the upper surface of the coating layer and providing an elastic layer between the coating layer and the connection terminal of the first circuit board.

CONSTITUTION: A fragile coating layer 22 is formed on the upper surface of a first circuit substrate 20 and a connection terminal 60 (70) composed of a metal is laminated to the upper surface of the coating layer 22 and the connection terminal 60 (70) and the connection terminal 90 of a second circuit substrate 80 are thermally fused through solder. In the laminated structure of the connection terminal of the circuit board, an elastic layer 1 is provided between the coating layer 2 and the connection terminal 60 (70) of the first circuit board 20. As a result, even when two circuit boards different in the coefficient of thermal expansion are bonded under heating and pressure by solder, a problem such as a crack or the like due to thermal expansion difference is not generated.