PURPOSE: To prevent surface terminals from being bruised through the contact with measuring terminal part by a method wherein a plurality of lasting pads are formed on the rear surface or the like of a COB board so as to connect each lasting pad and surface terminal part by a through hole or wiring pattern.
CONSTITUTION: In an IC card module, a plurality of lasting pads 10 are formed on the rear surface or the like of a COB board 1. Each lasting pad 10 and surface terminal part 3 are connected with each other by a through hole 11. Each terinal of an IC chip 4 is connected with each lasting pad 10 through a bonding wire 6, a bonding pad 5, wiring pattern 7, a through hole 8, the terminal pad of the surface terminal part 3 and a through hole 11. In order to test the electrical characteristics of the module concerned, measuring terminal is brought into direct contact with each lasting pad 10 under the condition that pressure is applied from above. Accordingly, the measuring terminal does not come into contact with the surface terminal part 3, resulting in allowing to prevent the surface terminal part 3 from being bruised.
TANAKA KENJI
OKAWA TOSHIHIKO
KAWADA SEIICHI
KAWASHIMA KAZUHIRO
