PURPOSE: To provide the laminated board small in the thermal expansion degree, excellent in through-hole reliability, suitable for mounting semiconductor devices such as CLCC or TSOP, and used for printed circuits.

CONSTITUTION: This low expansible laminated board comprising an insulating layer and a conductive layer disposed on at least one side of the insulating layer and used for printed circuits is produced by heating, pressing and integrally molding prepregs for the laminated board as an insulating layer, each of the prepreg being produced by coating and impregnating a low expansible resin composition containing (A) an epoxy resin having dicyclopentadienyl skeletons, (B) tetrabromobisphenol A and (C) a phenolic resin having dicyclopentadienyl skeletons as essential components on a fiber substrate and subsequently drying the product. A low expansible resin composition to be used for the laminated board and a prepreg to be used for the laminated boards are also provided.