PURPOSE: To reduce cost by forming a fine pattern by using conductive paste for connecting an nth layer with an (n+1)th layer.
CONSTITUTION: A conductor wiring circuit 12 as a first layer is formed by screen printing conductive paste on a glass or ceramic substrate 11 and baking the paste. Conductive paste for connecting the first layer with a second layer is printed, and a film 13 of conductive paste is formed by drying or baking after drying. Insulative paste is printed as a pattern having a viahole larger than or equal to the film 13 of conductive paste, and a film 14 of insulative paste is formed by drying or baking after drying. Conductive paste is printed on the film 13 of conductive paste and the film 14 of insulative paste, and a conductor wiring circuit 15 as a second layer is formed by baking after drying. If necessary, the above process is repeated and a wiring board having more layers can be manufactured.
NAKAO KEIICHI
HASHIMOTO AKIRA
MORI NOBORU
