PURPOSE: To prevent a substrate from being deformed or damaged even in using a hardly peelable bonding medium in forming a thin film of a high- temperature superconductor and enable the peeling of a substrate from a heater block in relation to a method for forming the film of the high-temperature superconductor and its apparatus.

CONSTITUTION: The objective method for forming a film of a high-temperature superconductor is to apply a thin film 18 of the high-temperature superconductor to a substrate 10 supported by a heater block 14 and then peel the substrate 10 having the thin film of the high-temperature superconductor from the heater block 14. In this method, the substrate 10 is attached to the heater block 14 with a bonding medium 12 such as a silver paste and a material of the high- temperature superconductor is then applied to the substrate 10 to form the thin film 18. The substrate 10 having the thin film of the high-temperature superconductor is subsequently peeled from the heater block 14. In the process, a part of the heater block 14 in contact with the substrate is constructed so as to be displaced relatively to the substrate.