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Title:
【発明の名称】バンプ電極用金線
Document Type and Number:
Japanese Patent JP2826169
Kind Code:
B2
Abstract:
PURPOSE:To prevent a reduction in the workability of a gold wire and the break of a chip while a breaking position is fixed constant and the tail residual amount of a ball is made short by a method wherein Ca and Y of a specified amount are respectively added to Au, which contains an unavoidable impurity and has a purity of 99.99 % or higher. CONSTITUTION:A wire is formed by a method wherein Ca of a concentration of 5 to 100 wt. PPm, Y of a concentration of 100 to 500 wt. ppm, Ge of one kind or two kinds of a concentration or concentrations out of a concentration of 30 to 100 wt. ppm and Be of one kind or two kinds of a concentration or concentrations out of a concentration of 5 to 15 wt. ppm are made to contain in high-purity Au. That is, as the Ca has an action to make high a recrystallization temperature at the time of formation of a ball, it has an action to shorten a recrystallization range at the time of formation of the ball, the Y has an action to shorten the recrystallization range at the time of formation of the ball and the Ge and the Be have an action to increase the workability of the wire. Thereby, while a breaking position is fixed constant and the tail residual amount of the ball is made short, a reduction in the workability and the break of a chip can be prevented.

Inventors:
HANADA SHINICHI
YAMAMOTO TAIYO
AKIMOTO HIDEYUKI
MUKOYAMA KOICHIRO
Application Number:
JP11603690A
Publication Date:
November 18, 1998
Filing Date:
May 02, 1990
Export Citation:
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Assignee:
TANAKA DENSHI KOGYO KK
International Classes:
H01L21/60; (IPC1-7): H01L21/60; H01L21/60
Domestic Patent References:
JP2170931A
JP6184346A
JP61163226A
Attorney, Agent or Firm:
Hayakawa Masaname