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Title:
METHOD AND APPARATUS FOR BONDING
Document Type and Number:
Japanese Patent JPH0637154
Kind Code:
A
Abstract:
PURPOSE: To provide a single-point bonding device for jointing a thin line or very thin line to another conductor by ultrasonic wave. CONSTITUTION: On a bonding chip 15, a thin-film resistor 20 is integrally formed by a standard photolithographic method which is used for bonding device. With a thermal energy combination such as ultrasonic wave energy and a resistor, a desired jointing energy is obtained. The jointing energy is localized in time and space. Thereby, the energy transmission to a selected work is optimized, resulting in least the possibility of damaging an adjoining heat-sensitizing element.

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Inventors:
ROBAATO EDOWAADO FUONTANA JIYU
RINDA EICHI REEN
SERIA ERIZABESU IETSUKUUSUKURA
Application Number:
JP10064293A
Publication Date:
February 10, 1994
Filing Date:
April 27, 1993
Export Citation:
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Assignee:
IBM
International Classes:
H01L21/607; B23K20/10; H01L21/60; (IPC1-7): H01L21/607
Domestic Patent References:
JPH02101754A1990-04-13
JPS54133451A1979-10-17
Attorney, Agent or Firm:
Koichi Tonmiya (4 outside)



 
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