SEMICONDUCTOR DEVICE AND ITS MANUFACTURE

Title:

SEMICONDUCTOR DEVICE AND ITS MANUFACTURE

Document Type and Number:

Japanese Patent JPH0685077

Kind Code:

A

Abstract:

PURPOSE: To achieve an improvement in the coverability for level difference in a contact hole and a lower resistance and also to provide a semiconductor device with improved electromigration resistance and its manufacture.

CONSTITUTION: Lower layer wiring 5 having a two-layer construction comprising an aluminum layer 4 and an alloy layer 12 made of aluminum and a group IV transition metal is connected to upper layer wiring 10 having two-layer construction comprising an alloy layer 13 made of a group IV transition metal and aluminum and an aluminum layer 9 through a contact hole 11, and an alloy layer 12 made of a group IV transition metal and aluminum, an aluminum layer 7, and an alloy layer 13 made of a group IV transition metal and aluminum are embedded in the order of the layers explained above from the lower layer wiring side.

Inventors:

MIYAMOTO IKUO

Application Number:

JP23221692A

Publication Date:

March 25, 1994

Filing Date:

August 31, 1992

Export Citation:

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Assignee:

KAWASAKI STEEL CO

International Classes:

H01L21/205; H01L21/28; H01L21/768; H01L23/522; (IPC1-7): H01L21/90; H01L21/205; H01L21/28

Attorney, Agent or Firm:

Tetsuya Mori (2 others)

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