Title:
【発明の名称】接合構造体
Document Type and Number:
Japanese Patent JP3095646
Kind Code:
B2
Inventors:
Mitsuhiko Matsui
Application Number:
JP31722494A
Publication Date:
October 10, 2000
Filing Date:
December 20, 1994
Export Citation:
Assignee:
Tokuyama Corporation
International Classes:
B23K1/19; C04B37/02; C04B41/88; C04B41/90; C23C14/08; (IPC1-7): C04B41/88; B23K1/19; C23C14/08
Domestic Patent References:
| JP569368A | ||||
| JP6069544A | ||||
| JP54159297A |