Title:
【発明の名称】物のレーザー加工方法
Document Type and Number:
Japanese Patent JP2592946
Kind Code:
B2
Abstract:
An improved method of laser processing of a material by directing a laser beam against the material comprises providing the beam with a power waveform with respect to time characterized by a plurality of peak power pulses and a predetermined CW power level between the peak power pulses such that the average beam power maintained is equal to or greater than the predetermined CW power level of the beam. The method is particularly adapted for cutting material such as aluminum, copper and stainless steel with improved cut quality at a relatively high cutting speed and for welding.
Inventors:
SHAAPU CHAARUZU EMU
YANGU RONARUDO DEII
YANGU RONARUDO DEII
Application Number:
JP50133188A
Publication Date:
March 19, 1997
Filing Date:
December 15, 1987
Export Citation:
Assignee:
PII AARU SHII CORP
International Classes:
B23K26/06; B23K26/20; B23K26/00; B23K26/36; B23K26/38; H01S3/00; H01S3/097; H01S3/10; H01S3/104; (IPC1-7): B23K26/00; B23K26/00
Domestic Patent References:
| JP4735996A |
Attorney, Agent or Firm:
Asahina Sota